BGA-nokunamathisela ngomthofu izakhiwo ekhaya

mkhuba esitebeleni electronics zanamuhla ukuqinisekisa ukuthi ukufakwa iba ohlangene ngaphezulu. Umphumela lokhu kwaba ukuvela kwezindaba housings BGA. Pike lezi zici ekhaya futhi sizobe kubhekwe ngaphansi kwalesi sihloko.

ulwazi olujwayelekile

Ekuqaleni behlaliswe iziphetho abaningi ngaphansi komzimba chip. Ngenxa yalokhu, bona babekwa endaweni encane. Lokhu kukuvumela ukuba ugcine isikhathi dala amadivayisi Okuncane ezingasho. Kodwa khona ngale ndlela ekwenziweni uphendulela ngokuphazamisa ngesikhathi ukukhanda zikagesi ngamaphakeji BGA. Brazing kulesi simo, kufanele kube ngokuyikho nangendlela enembile ukwenziwa ubuchwepheshe.

Yini okudingeka?

Udinga Thenga kakhulu:

1. Nokunamathisela ngomthofu esiteshini, lapho kukhona isibhamu ukushisa.
2. Udlawana.
3. Solder unama.
4. Tape.
5. Desoldering eluka.
6. Flux (mhlawumbe zikaphayini).
7. Stencil (ukusebenzisa solder unama ku-chip) noma spatula (kodwa kungcono ukuhlala samuntu sokuqala).

Nokunamathisela ngomthofu BGA-amabutho akuyona into kuyinkimbinkimbi. Kodwa ukuthi luyasetshenziswa ngempumelelo, kubalulekile ukuba afeze ukulungiswa kwendawo yomsebenzi. Futhi ukuthi kungenzeka ukuphindaphindwa izenzo echazwe esihlokweni kutjelwa izici. Khona-ke ubuchwepheshe nokunamathisela ngomthofu chips BGA iphakethe ngeke kube nzima (uma ikhona ukuqonda inqubo).

Izici

Ukutshela ukuthi ubuchwepheshe solder BGA amaphakheji, kufanele kuphawulwe izimo ukuphindaphinda amakhono egcwele. Ngakho, lalisetshenziswa stencil-Chinese ezenziwe. engavamile wabo ukuthi kukhona chips eziningana ziqoqwa ocezwini esisodwa esikhulu. Ngenxa lokhu lapho stencil evuthayo uqala goba. Usayizi enkulu iphaneli kuholela yokuthi ayoyikhetha lapho amalahle imali enkulu ukushisa (ie, kuba nomphumela kurediyetha). Ngenxa yalokhu, badinga isikhathi esengeziwe kulungele chip (okuba nomthelela omubi nokwenza kwayo) wena. Futhi, izinto zokwenza amakhophi anjalo akhiqizwa etching zamakhemikhali. Ngakho-ke, unama sisetshenziswa akulula kangako njengoba kule amasampula eyenziwe laser cutting. Nokho, uma ukuya thermojunction. Lokhu kuzovimbela eguqa stencil ngesikhathi Ukushisa yabo. Futhi ekugcineni kufanele kuphawulwe ukuthi imikhiqizo eyenziwe usebenzisa laser cutting, inikeza ukunemba okuphezulu (ukuphambuka ingeqi 5 microns). Futhi ngenxa yalesi kungaba elula elula asebenzise i-design nezinye izinjongo. Ngalesi ukubusa usuphothuliwe, futhi ngeke ukuhlola ukuthi kukhonani nokunamathisela ngomthofu BGA iphakethe ubuchwepheshe ekhaya.

ukuqeqeshwa

Ngaphambi kokuqala otpaivat chip, kubalulekile ukubeka kuthintwa kokuphothula onqenqemeni umzimba wakhe. Lokhu kumele kwenziwe ngokungabi bikho wokunyathelisa kwesikrini, obubonisa ingxenye isikhundla electronic. Lokhu kumele kwenziwe lula ekwakhiweni okwalandela chip emuva ebhodini. Nokomisa kumele ukukhiqiza umoya ngemfudumalo ku 320-350 degrees Celsius. Kulesi simo Isivinini emoyeni kufanele kube sakugcina (ngenye zizoshintsha emuva ngokufanele solder eduze). Nokomisa kufanele igcinwe ukuze perpendicular ebhodini. Preheat ke ngale ndlela cishe umzuzu. Ngaphezu kwalokho, umoya akumele ithunyelwa isikhungo nobukhulu (onqenqemeni) ebhodini. Lokhu kuyadingeka ukuze ugweme okweqile we crystal. A ikakhulukazi ebucayi kule inkumbulo. Kulandele hook kwelinye emaphethelweni chip, futhi bona ahlule ebhodini. Omunye akufanele sizame likhiphe okusemandleni ami. Phela, uma solder awuzange elicibilikile ngokuphelele, khona-ke kukhona ingozi zokudonsa ithrekhi. Ngezinye izikhathi uma sisebenzisa ecucuza futhi solder ukufudumala iqala ukuba kubuthelwe amabhola. ubungako bawo liyobe engalingani. Futhi nokunamathisela ngomthofu chips BGA iphakethe izohluleka.

yokuhlanza

Sebenzisa spirtokanifol, kulungele ke bese udoti eziqoqiwe. Kulokhu, uqaphele ukuthi indlela efanayo ayikwazi lisetshenziswe ngabe yikuphi lapho esebenza nokunamathisela ngomthofu. Lokhu kungenxa Coefficient ongaphakeme ethize. Kulandele ahlanzekile kuze endaweni umsebenzi, futhi kungaba yindawo enhle. Khona-ke, ukuzohlola isimo okutholakele futhi ukuhlola ukuthi kungenzeka ukuzifaka endaweni endala. Nge impendulo ezimbi kumele esikhundleni. Ngakho-ke kubalulekile ukuba usule ibhodi and chips we solder ubudala. Kukhona kungenzeka ukuthi lowo muntu uyakunqunywa "penny" ebhodini (usebenzisa eluka). Kulokhu, kahle kungasiza elula nokunamathisela ngomthofu yensimbi. Nakuba abanye abantu besebenzisa nge eluka futhi izinwele dryers. Lapho manipulations kokwenza kufanele ukuqapha ubuqotho imaskhi solder. Uma lilimele, ke rastechotsya solder kanye ezindleleni. Bese BGA-nokunamathisela ngomthofu ngeke aphumelele.

Knurled amabhola entsha

Ungasebenzisa izikhala kakade walungisa. Ziyakwazi Kulezo zimo, udinga nje ukuhlunga ngokusebenzisa pads zigcwale amanzi. Kodwa lena kuphela ezifanelekela inombolo encane iziphetho (ungacabanga chip ne-250 "izinyawo"?). Ngakho-ke, njengoba indlela kulula screen technology isetshenziswa. Ngenxa yalesi umsebenzi wenziwa ngokushesha futhi ne izinga elifanayo. Okubalulekile lapha ukusetshenziswa eliphezulu solder unama. Kuzobakhuthaza ngokushesha siguqulelwa brilliant ibhola bushelelezi. ikhophi kwekhwalithi eliphansi okufanayo ngeke iba yingxenye yomhlabathi enombolweni enkulu round "izingcezwana" amancane. Futhi kulokhu, ngisho iqiniso lokuthi amalahle kuze kube degrees 400 ukushisa kanye ukuxuba nge ecucuza kungasiza. Ukuze kube lula chip is fixed-stencil. Khona-ke, usebenzisa spatula ukusebenzisa solder unama (nakuba ungasebenzisa umunwe wakho). Khona-ke, ngesikhathi esifanayo ulondoloze isimo stencil amashiya, kubalulekile ukuba Ncibilikisa unama. dryer lokushisa kumele singeqi 300 degrees Celsius. Kulokhu idivayisi kufanele perpendicular unama. I-stencil kufanele kugcinwe kuze solder Uqinisa ngokuphelele. Ngemva kwalokho ungakwazi ukususa tape yasibamba futhi dryer ekuvikeleni, umoya okuyinto osuke usushisa kakade ukuba degrees 150 Celsius, ngomusa ukufudumeza lize iqala igcwale amanzi yokucucuza. Ungabese unqamula chip-stencil. Umphumela wokugcina izotholwa amabhola bushelelezi. Chip futhi ukulungele ngokugcwele ukuyifaka ebhodini. Njengoba ubona, nokunamathisela ngomthofu BGA-amagobolondo akuzona eziyinkimbinkimbi futhi ekhaya.

iziqobosho

Ngaphambili, kuphakanyiswe ukwenza kuthintwa aliqede. Uma lesi seluleko, ukuma awuzange kunakwe kumele kwenziwe kanje:

1. Flip chip kangangokuba kwaba up iziphetho.
2. Namathisela kuya Dimes onqenqemeni ukuze luqondane amabhola.
3. Siyilungise, okufanele onqenqemeni chip (salokhu imihuzuko okuncane ngenaliti singasetshenziswa).
4. Iqinile, kuqala omunye indlela bese perpendicular ke. Ngakho-ke, kuyoba okwanele imihuzuko ezimbili.
5. Sibeke chip ku namagama futhi sizame ukubamba amabhola uthinte pyataks ezindaweni eziphakeme esiphezulu.
6. Kuyadingeka ukuba kulungele endaweni umsebenzi kuze solder isebujameni esibunjiweyo. Uma izinyathelo ezingenhla zenziwa ncamashi chip akufanele kube inkinga esihlalweni sakhe. Lokhu kuzosiza ibutho lalo surface ukungezwani, esesikhundleni solder. Kuyadingeka ukubeka impela kancane ekucucuzeni.

isiphetho

Lapha konke ngokuthi "ubuchwepheshe of nokunamathisela ngomthofu chips BGA iphakheji." Kufanele kuqashelwe lapha osebenza engazazi ukuthi nayizimfundamakhwela kakhulu umsakazo nokunamathisela ngomthofu iron ne umshini wokomisa izinwele. Kodwa, naphezu kwalokhu, ama-BGA-nokunamathisela ngomthofu sikhombisa umphumela omuhle. Ngakho-ke, kuqhubeka ukujabulela futhi ukukwenza kakhulu ngempumelelo. Nakuba entsha njalo bethukile eziningi, kodwa isipiliyoni esiwusizo lobu buchwepheshe ekubeni ithuluzi kuyinsakavukela.